OPC+ is the world＇s first universal cloud OPC platform spanning i-line, KrF 248nm, and ArF 193nm while natively supporting free form designs in silicon photonics, metasurfaces, and advanced packaging. Based on CMOS most advanced ILT algorithms, OPC+ achieves >50× speedup with GPU acceleration over CPU-based tools with three deployment modes (public cloud, private on-premise, hybrid). OPC+ has been validated at TSRI KrF 248nm process and under evaluation by ITRI, TSMC, and Texas Instruments.

OPC+ is the world＇s first universal cloud OPC/ILT platform spanning i-line, KrF, and ArF with native freeform support for silicon photonics, metalenses, and metasurfaces — no Manhattan pre-processing. Key innovations: (1) CUDA Multi-Stream GPU achieving >50× CPU speedup; (2) automated 2D CD-SEM contour calibration cutting cycle 80%, model error <2.2%; (3) Offer public, private, and hybrid cloud deployment. Patent filed to TW/US. Validated TSRI KrF 248nm; evaluated by TSMC and Texas Instruments.

OPC+ offers three deployment modes — public cloud, private on-premise, and hybrid — serving SME foundries, fabless design houses, silicon photonics startups, mask shops, and academic institutions. Confirmed deployments include: TSRI private-cloud server (delivery Q4 2026); ITRI ArF 193i line integration (quote stage); TSMC-NYCU JDP evaluation; Texas Instruments tool assessment; paid MRAM correction for TOPO-Logic Inc. (Japan); silicon photonic validation with University of Southampton, etc.