We developed GaN HEMTs, 940 nm and 1550 nm PCSELs, and integrated light-source circuits combining GaN current drivers, gate drivers, passive components, and lasers. Using flip-chip bonding, we demonstrated a high-density, high-speed (<5 ns, >50 MHz), high-power SoP pulsed laser source. We also realized monolithic integration of a PCSEL and metasurface hologram, achieving a footprint about 2450× smaller than commercial dot projectors while reducing power consumption to 71.3%.

The key innovation of this research is the development of next-generation electronic and photonic technologies, including high-current, high-speed GaN HEMTs, 940/1550 nm photonic crystal surface-emitting lasers (PCSELs), and metasurfaces. Through advanced circuit design and flip-chip heterogeneous integration on high-thermal-conductivity AlN substrates, a System-on-Package (SoP) LiDAR laser source is realized, enabling high-power, high-speed, and compact solid-state LiDAR systems for advanced sensing applications.

光達為自駕車、機器人與智慧感測之關鍵技術。本計畫整合GaN HEMT、新世代PCSEL及超穎介面開發光學相位陣列，開發長距離、高速、低功耗之固態光達光源。透過先進封裝，實現高可靠度、小型化及低成本光達模組，應用於智慧駕駛、工業自動化及3D感測。研究成果可延伸至AR/VR、光電元件與智慧製造。