This technology utilizes electrospray deposition to coat ultrathin fluorescent nanodiamond films onto semiconductor devices. By integrating lock-in photoluminescence thermography and optically detected magnetic resonance, it enables nanoscale, real-time temperature and magnetic field sensing of operando devices. Achieving a hotspot localization precision of 30 nm, the method outperforms conventional infrared thermography, clearly demonstrating the advantages of quantum sensing technology.

Pioneering electrospray deposition of fluorescent nanodiamond (FND) quantum probes onto semiconductor chips, we have established a high-resolution, real-time monitoring platform capable of dynamically tracking thermal variations without point-by-point scanning or tedious calibration. Outperforming infrared thermography, it boosts localization precision 100-fold down to the nanoscale. This accessible and high-precision platform offers an innovative diagnostic solution for thermal management.

Targeting advanced semiconductor thermal management and leakage localization, this technology provides a non-destructive, real-time, high-resolution failure-analysis tool. It enables nanoscale hotspot detection for both pre-packaging wafer-level defect screening and post-packaging thermal evaluation under real loads. Capable of upgrading or replacing current IR thermography, it helps foundries and IC designers shorten R&D cycles and significantly boost manufacturing yields.