This technology integrates silicon photonic MZM, ultra-wideband QDLD, and MCF to achieve optical transmission up to 19.504 Tb/s. By utilizing a single comb laser source with multiplexing architectures, the system improves bandwidth density while reducing power consumption and packaging complexity. The technology is CMOS-compatible and suitable for mass production, making it promising for AI data centers, CPO, and next-generation high-speed optical interconnects.

We integrated a QDLD, silicon photonic modulators, and multi-core fiber to achieve 19.504 Tb/s optical transmission (212 Gb/s × 23 wavelengths × 4 cores). Compared with conventional multi-laser architectures, the system uses a single light source to generate 23 stable wavelength channels, reducing power consumption and packaging complexity. After 2 km transmission, all channels maintained TDECQ values below 2.02 dB, demonstrating high-speed performance and CMOS-compatible integration potential.

This technology addresses key challenges in AI data center interconnects, including limited bandwidth, high power consumption, and packaging density constraints. By integrating silicon photonics with a single QDLD architecture, the system enhances transmission capacity while reducing complexity. With CMOS-compatible manufacturing, the technology offers strong scalability and commercialization potential for CPO, optical transceivers, switches, and next-generation optical communication systems.