AlixLabs' unique and patented Atomic Layer Pitch Splitting (APS) is a novel plasma-based etching method that selectively targets surface topology. This breakthrough technology eliminates several complex steps in chip manufacturing, enabling more efficient, cost-effective, and sustainable semiconductor production.

AlixLabs' APS technology offers a disruptive, sustainable method for advancing semiconductor scaling. APS enables sub-10nm features via atomic-precision processes, without costly next-gen lithography. Fully compatible with existing tools, APS reduces Capex and Opex, lowers energy and water use, and cuts CO₂ emissions.