This project develops a 3D packaging bonding solution and smart platform integrating light-based surface treatment, mini electrochemical sensing, and AI prediction. It enables real-time analysis of copper oxidation and estimation of Cu–Cu bonding strength. Featuring portability, vacuum-free and non-destructive operation, and real-time feedback, it enhances yield, efficiency, and stability. The technology offers strong potential for next-generation semiconductor manufacturing.

This technology uses multi-wavelength light to modulate Cu surface lattice stress and functional groups, enabling Cu–Cu bonding under atmospheric conditions and avoiding vacuum or plasma processes. A miniaturized electrochemical chip enables real-time analysis of oxide phases and thickness. Integrated with AI-based modeling, the platform allows immediate feedback and bonding strength prediction, highlighting innovation across materials science, electrochemistry, and AI with strong scalability.

This technology targets key 3D packaging processes such as hybrid bonding in heterogeneous integration, replacing plasma treatments by enabling copper diffusion without vacuum. With integrated mini electrochemical sensing and AI prediction, it enables real-time oxide monitoring and automated control. The approach improves bonding strength and yield, offering high compatibility, scalability, and strong potential for commercialization and production deployment.