Based on the key technology of multi-function sensing, combined with heterogeneous package, interface circuitmulti-environment wafer level sensorlow-cost, low power, high sensitivity multi-sensing system, finally complete the three sensing technology smart application demonstration.
Application Exhibition (1): Smart Robot
Application Exhibition (2): PaS(PlugSensor)
Application Exhibition (3): SOMA CUBE

"Smart Robot
1.Breakthrough of Multi-sensing Functions in a Single Chip Technology in Taiwan
2.Zero-energy Sensor without External Power Supply
3.Low Cost Sensor by 3D Vertical Hetrogeneous Package Technology
PaS
1.Low Current Mode Support by Using Smart Energy Storage Mechanism.
2.Low Power Mode Support by using Embbeded Firmware Auto-detection Technique 
3.Accurate Sensing Support with AI Self-C

"Smart Robot
1.Disaster Prevention Industry 
2.Vehicle Electronics 
3.Intelligent Fabrication 
4.AI Intelligent Sensing 
PaS 
1.Wearable Sensing Devices (Personal Health Care System, Environmental Sensing System)
2.AI Intelligent Sensing Devices (Intelligent Electric Appliance)
SOMA CUBE:
1.Virtual interaction
2.Smart Manufacturing (Smart Assembly)
3.Vehicle electronics (part displacement)
4.Disas