This project presents a terahertz single-pixel imaging system with high SNR and bandwidth based on a pulsed photoconductive antenna and a photoconductive spatial light modulator. A 3D tensor-based compressed sensing model compresses terahertz responses in spatial and temporal domains, preserving full waveform information for semiconductor material identification. The SOC system integrates an FPGA-based 3D imaging accelerator, enabling real-time refractive index imaging for material analysis.

This study presents the world’s first integrated system combining terahertz device design, single-pixel compressed sensing modulation, 3D tensor-based image reconstruction algorithms, and an FPGA-based SoC. It enables non-contact, high-speed 3D terahertz imaging. This integration system achieves real-time 3D image reconstruction for semiconductor inspection, delivering a 441× speed increase and 313× hardware efficiency improvement, demonstrating high practical value and innovation.

The FPGA/SoC-based THz single-pixel compressive sensing system delivers a breakthrough: high-speed, high-quality spectroscopic imaging. This unlocks crucial industrial applications: precise non-destructive testing in semiconductor packaging for internal defect detection, advanced material characterization (e.g., doping levels), and rapid identification of substances via unique spectral fingerprints, significantly enhancing quality control, safety, and security across various sectors.