This analytical instrument integrates microscopic imaging and hyperspectral modules, employing AI-driven deep learning image analysis to interpret material spectral information. It features micrometer-scale positioning accuracy and high-resolution microscopic imaging capabilities, enabling quantitative hyperspectral image analysis.Unlike conventional hyperspectral systems that provide only qualitative analysis, this instrument is capable of measuring key physical parameters such as transmittance, reflectance, and absorbance. It is therefore well suited for the high-precision microscopic imaging and analysis of micro- and nano-scale materials as well as biological tissues.

The system integrates microscopic imaging with hyperspectral technology and incorporates AI-driven deep learning for spectral analysis. It overcomes the limitations of conventional systems that are restricted to qualitative evaluation, enabling micrometer-scale spatial resolution and the quantitative measurement of physical parameters. This significantly enhances analytical capabilities for micro- and nanoscale materials as well as biomedical imaging applications.

This technology can be applied to semiconductor process inspection, optoelectronic display material analysis, and biomedical imaging diagnostics. It supports the measurement of optical properties for wafers, thin films, and biological tissues. By integrating AI-based spectral analysis with microscopic hyperspectral imaging, the system can be deployed for in-line automated inspection and quality control. It accelerates new material development and process optimization, thereby improving yield and operational efficiency in the semiconductor and precision manufacturing industries.