Technical Name Ultra-thin Camera Module
Project Operator Industrial Technology Research Institute
Project Host 張家榮
Summary
With chip-level fabrication and 3D nanopillar design, precise optical control is now achievable. This approach enables planar implementation of traditional lens functions, thereby reducing overall camera size and weight. At the same time, it simplifies the complex assembly of multiple stacked lenses, allowing a single metalens to effectively replace conventional multi-element plastic optics.
Industrial Applicability
The scope of this technology includes optical module manufacturers for portable devices. For vision-sensing camera applications, it enables the lightweight and thin design of traditional lenses while reducing sensitivity to vibration caused by multi-element stacking. In addition to lightweight camera use cases, it is also applicable to robotic vision and environmental sensing applications.
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  • Berra Chang
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