Technical Name Utilization of novel chemical displacement environmental protection coating technology to be applied on RFID antenna production
Project Operator National Cheng Kung University Hierarchical Green-Energy Materials (Hi-GEM) Research Center
Project Host 李文熙
"1. The first thick film screen printing Cu electrode with high conductivity ( 10-6 Ω), which is comparable to thick film Ag electrode has been successfully made in air firing instead of reducing atmosphere firing
 2. The concentration of Al increased dramatically at the beginning when the specimen was immersed at high solution temperature since the replacement reaction was intense.
 3. To make a good thick film screen printing Cu electrode by the novel method we proposed in this study, it is necessary to optimize the Al paste parameters such as solid content, particle size of Al powderCuSO4 solution parameters such as pH , temperature, soaking time."
Scientific Breakthrough
This research proposes the fourth type of electroless plating technology-innovative electroless plating. Based on the principle of displacement electroless plating, the three characteristics of thick-film aluminum electrodes are used for chemical displacement metallization: (1) The high oxidation potential of aluminum metal (-1.66eV) can be applied on various metal coatings (2) The porous structure of thick film aluminum electrodes can replace the innerouter aluminum electrodes instead of just replacing the surface (3) The aluminum powder is very cheapsuitable to be used as a replacement sacrificial layer without increasing the manufacturing cost.
Industrial Applicability
To improve the current general electroplating solution process of the FPC RFID antenna by the subtractive method used in the industry, the first stage of environmental improvement is to use the additive method to directly produce the FPC RFID antenna, to avoid excessive wastemeet the environmental protection process. The next stage is to use the thick-film base metal aluminum electrode addition process, combined with semiconductor electroplating copper sulfate waste to enter the galvanic replacement reaction, to convert the original thick-film aluminum electrode into a high-conductivity copper electrode that can be applied to FPC RFID antenna production to improve the non-environmentally friendly process of copper electrodes.
Keyword Thick film printing conductor displacement electroless plating reliability failure analysis chip resistor MLCC RFID antenna automobile components
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