Technical Name High Precision Maskless Lithography System for Advanced IC Substrates and Packaging
Project Operator Engineering & Technology Promotion Center
Project Host
Summary
This project develops a high-precision maskless lithography system consists of digital light processing, microlens / spatial filters arrays, and precision servo-controlled motion technologies. Based on this maskless UV lithographic system, we are able to achieve UV patterning of arbitrary and complicated 2D/3D microstructures for advanced IC substrate and packaging.
Scientific Breakthrough
已經獲得:台灣、美國、中國大陸三個地區的專利
Industrial Applicability
This maskless UV lithographic technology is particular important for large-area substrate demanding complex patterns with smaller (~10 um) feature sizes. It also has the flexibility for making three dimensional microstructure profiles on planar substrates.
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