1. A novel technology to provide a kind of thin substrate with magnetic and strong mechanical strength for microLED, then the LED epitaxy film can transfer to the substrate and a very thin LED can be achieved.
2.By applied this CIC substrate which the major components of this composite metal substrate are Cu/Ni-Fe/Cu, the microLED chips can be obtained and separated by chemical etching.
3.This CIC substrate with magnetic property can be applied on the mass transfer of microLED fabrication.

(1)Inventing a  composite metal substrate with a tuning thermal expansion coefficient by metal thickness tuning
(2)Fabrication of thin film LEDs with magnetic property and high mechanical strength by wafer bonding and epilayer transfer technology
(3)Fabrication of chips by etching of layers- ultra thin micro LEDs with high mechanical strength
(4)Mass transfer by magnet characteristics.

(1)Key technology for micro-display fabrication is mass transfer, which can be achieved by  this technology with magnetic transfer.
(2)Light source of car industry, Laser and VCSELs.
(3)From the upstream metal substrate industry, the epitaxy manufacturing , to the LED application industries, and even another technology that provides a mass transfer of the equipment industry, the application of LEDs can be extended to more specific applications.