Biomimetic adhesive has some characteristics: no residual glue, anisotropic adhesion, easy to be peeledstuckrepeated. Its adhesion could be adjusted depend on the application. The adhesive can be applied but not limited in wafer processing, movement of optoelectronic materials, 3C product assembly, daily-used fixation,producing a protective film for attaching to an object surface.

Based on the subsidized project from the MOST of Taiwan, we employ some simulation techniques to find the design rules of adhesive materials. Furthermore, text mining is applied to summarize biomimetic adhesive information in publications to establish the related trendgoal, giving us a direction to confront special adhesion property under manufacturable consideration.

The dry adhesive can be applied but not limited in wafer processing, movement of optoelectronic materials, 3C product assembly, daily-used fixation,producing a protective film for attaching to an object surface, including optical glass, LCD panels, solar cells, semiconductor elements (for chipspackages), silicon wafers, metals,so on.