| Technical Name | Innovative full-field profilometric systemkey measuring techniques for automated optical inspection of micro bumps | ||
|---|---|---|---|
| Project Operator | National Taiwan University | ||
| Project Host | 陳亮嘉 | ||
| Summary | The technology provides an innovative measuring method for microscopic 3D surface profilometry, especially for semiconductor packaging. An one-shot full-field confocal microscopic surface profilometer using digital micro-mirror device (DMD) has been successfully developed. Most importantly, a novel measuring method was the first time being proposed to encodedecode depth information of surface |
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| Scientific Breakthrough | - |
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| Industrial Applicability | - |
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| Keyword | __ __ | ||
| Notes | |||
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