This platform provides advanced packaging technologies and features the exclusive "CoCoB" (Chip-on-Chip-on-Board) architecture, eliminating traditional packaging substrates to meet the massive computing demands of modern data centers.

Breaking the limits of Moore's Law, it combines sensing and computing to create a key platform for AI and system-level innovation, launching a new semiconductor model through "sensing + packaging + system integration."

Accelerates the commercialization of forward-looking technologies by connecting industry and academia. It attracts global research teams to invest in the design and verification of AI computing and high-frequency communication modules.