"Sub-teraertz High-Speed ​​Transparent Inspection Technology" is an intelligent, rapid screening and triage mechanism that fundamentally solves the bottlenecks of current ultrasound and X-ray inspections. Utilizing patented 3D circuit stacking technology, it achieves an ultra-lightweight 1.5kg handheld design and combines it with AI automatic annotation technology; a single unit can replace the work of 13 people. This solution boasts non-contact, second-level imaging advantages.

Leveraging the non-contact, non-radioactive characteristics of Sub- Terahertz technology, it overcomes the drawbacks of traditional ultrasound requiring coupling agents and X-rays requiring field clearing, increasing efficiency by 13 times. Through 3D circuitry miniaturization to 1.5kg, combined with RAG technology for automatic linking to the maintenance manual, it achieves a smart closed loop of "inspection-based decision-making."

The core of this technology lies in the value of "intelligent rapid screening and triage." It doesn＇t completely replace ultrasound or X-rays; rather, it filters out over 95% of non-abnormal structures at extremely high detection speeds. This allows truly questionable materials to be accurately returned to precision instruments for in-depth analysis, eliminating queuing bottlenecks in the testing line and achieving a smooth industrial chain where "detection equals decision-making."