This project develops an EDA tool chain for advanced packaging designs. From the system performance evaluation, full-chip thermal simulation and timing analysis, to the physical design for chip-package co-optimization, we all have plans to solve the design bottleneck. Finally, those solutions will be integrated to ITRI's open EDA platform to help local industry deal with advanced packaging issues.

Advanced packaging is key to boosting chip performance, but EDA tools are dominated by global companies, limiting local innovation. To address new design challenges, we integrate academic EDA research to develop tool chain for next-gen chip design, build local EDA design flow, and use ITRI's open EDA platform to help companies adopt these tools and successfully develop advanced packaging products.