| Technical Name | ChipsSubsystems for the Next-Generation Communication System over mm-Wave Bands | ||
|---|---|---|---|
| Project Operator | National Applied Research Labroratories | ||
| Project Host | - | ||
| Summary | "The demonstrated technologies include: (1) 38GHz millimeter-wave CMOS transmitreceive integrated circuits using CMOS technology to realize the low-power transmittersreceivers required for the future millimeter-wave communications (2) Millimeter wave array antenna (3) High-performance radio frequency front-end key components based on GaAs semiconductor process technology over millimete |
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| Scientific Breakthrough | - |
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| Industrial Applicability | - |
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| Keyword | |||
| Notes | |||
- Contact
- futuretech.most@gmail.com
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