IC Taiwan Grand Challenge Unveil

From 28 countries and 150 proposals, 8 standout startups of the 3rd IC Taiwan Grand Challenge are set to drive innovation in AI chips, semiconductors, smart healthcare, LEO satellites, and more. Join the ICTGC Unveil to meet these forward-looking innovators!

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AGENDA

13:00-13:05

Remarks

13:05-13:35

AI Core Technologies & Chips

Novel AI Accelerator (SPU-001) – 10x capacity, 100x energy efficiency, seamlessly embedding AI into smart devices
femtoAI │ Sam Fok , CEO

LLM processing unit – Enabling efficient and sustainable Generative AI with large language model inference accelerator
HyperAccel │ Seungjae Moon, Principal Researcher and Co-founder

Automated AI Chip Design – Compressing large models into smaller form factors, accelerating AI product deployment
DeepMentor Inc. │ Jack Wu, CEO/Founder

13:35-13:45

Smart Manufacturing

Next-Generation Semiconductor Process – Breaking optical limits to achieve sub-20nm chip structures at low cost
AlixLabs AB │ Amin Karimi, COO and Co-founder

13:45-13:55

Smart Mobility

LEO Satellite Chipset – Integrating RF and AI computing to power high-speed global satellite communications
Brilliant Silicon Technology Co., Ltd. │ Ming-Fong Lei, Director of Product Marketing

13:55-14:05

Smart Medtech

AI-Powered Nasopharyngeal Cancer Endoscope – Miniaturized, disposable design for safer and more precise early detection
EndoSemio Co., Ltd. │ Ruby Hung, Chief Marketing Officer

14:05-14:25

Sustainability

Energy-Efficient Metal 3D Printing – Low-cost fabrication of advanced structures for cooling and clean energy applications
3D Architech, Inc. │ Kai Narita, CEO

Smart Eco-Building Facade – Purifies air, reduces energy consumption by 60%, and enables sustainable urban architecture
PurCity ApS │ Morteza Ghorbani Eftekhar, CEO