貴賓致詞

AI CORE TECHNOLOGIES AND CHIPS

獨特 AI 加速器(SPU-001) — 10 倍容量、百倍能效，讓 AI 無縫融入智慧裝置
Sparse AI Accelerator – 10× capacity and 100× efficiency, seamlessly embedding AI into everyday devices.

femtoAI (UNITED STATES) │ Sam Fok, CEO

LLM 運算單元 — 以大型語言模型推論加速器實現高效與永續的生成式 AI
LLM processing unit – Enabling efficient and sustainable Generative AI with large language model inference accelerator

HyperAccel (REPUBLIC OF KOREA) │ Seungjae Moon, Principal Researcher and Co-founder

Hi-Hi：以即時多模態邊緣AI重新定義人機互動
Hi-Hi: Revolutionizing Edge Devices with Multimodal AI Acceleration  

DeepMentor Inc. 滿拓科技(TAIWAN)│ Jack Wu 吳昕益, CEO and Founder

SMART MANUFACTURING

次世代半導體製程 — 突破光學極限，低成本實現亞 20 奈米晶片結構
Next-Gen Semiconductor Manufacturing – Breaking optical limits to enable sub-20nm chip structures at lower cost.

AlixLabs AB (SWEDEN) │ Amin Karimi, CTO and Co-Founder

SMART MOBILITY

低軌衛星晶片組 — 整合射頻, 高效能, 與智能運算，推動高速全球衛星通訊
LEO Satellite Chipset: Integrating RF, efficiency, and smart computing to drive high-speed global satellite communications

Brilliant Silicon Technology Co., Ltd.  錡曄電子有限公司 (TAIWAN) │ Ming-Fong Lei, Director of Technical Marketing

SMART MEDTECH

AI 耳鼻喉內視鏡 — 即時影像強化，重新定義頭頸癌早期檢測
AI-Powered ENT Endoscopy – Redefining Early Cancer Screening with Real-Time Imaging Enhancement.

EndoSemio 安德斯醫學科技 (TAIWAN) │ Ruby Hung, CMO

SUSTAINABILITY

節能金屬 3D 列印 — 低成本打造高效散熱與清潔能源應用的關鍵金屬結構
Energy-Saving Metal 3D Printing – Low-cost fabrication of high-performance metal structures for cooling and clean energy.

3D Architech, Inc. (UNITED STATES) │ Kai Narita, Founder and CEO

智慧環保建築外牆 — 淨化空氣並降溫，降低能耗 60%，打造永續建築
Smart Eco-Friendly Facade – Purifies air and cools buildings, reducing energy use by 60% for sustainable living.

PurCity ApS (DENMARK) │ Morteza Ghorbani Eftekhar, Founder and CEO

結語