TECH INNOVATION EXCELLENCE AWARD

KEEN TO COOPERATE WITH TAIWAN’S WORLD-LEADING TECH SECTOR?

WHAT IS TIE AWARD

The “Tech Innovation Excellence Award (TIE Award)” is a contest co-organized by Taiwan’s National Science and Technology Council (NSTC) and other Taiwanese governments. The TIE Award offers a stage to recognize cutting-edge technologies worldwide, aiming to connect the global startups with their potential partners from Taiwan’s high tech companies to create a mutually beneficial cooperation.

3rd EDITION

30+ COUNTRIES

300+ TECHNOLOGIES

TIE AWARD

  • WHY ATTEND
  • AWARDS & PRIZES
  • TIMELINE
  • PREVIOUS WINNERS
  • ENTRY CRITERIA
APPLY NOW!

WHY ATTEND

WE FOCUS ON SEMICONDUCTOR APPLICATION THIS YEAR!

  • CONNECTIONS

    Connect with industry experts,
    investors & fellow entrepreneurs.

  • VISIBILITY

    Pitch or showcase opportunities in front of renowned industry leaders & investors.Get spotted by international media, with interview opportunities.

  • DEMO & BOOTH

    Winners will be invited to come to Taiwan and attend the TIE Award Unveil, also have a booth at Future Tech Pavilion in Taiwan Innotech Expo.

SELECTION CRITERIA

  • APPLICATION INNOVATION
  • VALUE CREATION
  • LOCAL INTEGRATION

AWARDS & PRIZES

TIE award 2023 TIE award 2023獎牌
  • Opportunities to partner with Taiwan’s top tech companies
  • Cash prizes
    • 1st Place: USD 30,000
    • 2nd Place: USD 20,000
    • 3rd Place: USD 10,000
  • Honorable mentions: USD 7,000 each.
  • Winning teams from overseas will receive partial subsidy for flight tickets and accommodation (details to follow)
  • TIE Award trophy
  • Logo and usage rights for the award granted
  • Coworking space in Taiwan Tech Area (TTA)

TIMELINE

(in Taiwan Standard Time, GMT+8)

  • ONLINE REGISTRATION

    Fill out the Basic Information and Concept Paper ON-LINE, also submit the IP Statement and Affidavit.

  • INITIAL REVIEW(concept paper)

    The result of it will be notified by e-mail individually by the end of July, 2024.

  • FINALISTS ANNOUNCED
    • The result of TIE Award will be announced in mid-August, 2024.
    • The winner's solution will be presented at the Taiwan Innotech Expo (TIE).
  • ELIGIBILITY REVIEW

    It will be conducted
    by the end of June, 2024.

  • SECONDARY REVIEW (presentation)

    The presentation and secondary review will complete in early-August, 2024.

For actual dates will be announced by TIE Award Team, please refer to the publishing information on this homepage.

PREVIOUS WINNERS

SEE AWARD WINNERS WHO SHOWCASE THE BEST EXAMPLES OF INNOVATION!

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ENTRY CRITERIA

  • TIE Award’s definition of ”technology” is hardware or software produced as a result from R&D operations. ”Applicant” is defined as startups, legal entities (including individuals), or academic/research institutions.
  • Startups must have been legally registered after January 1, 2016.
  • Applicants must own the intellectual property rights, or have received legal authorization to use the technology or solution.
  • Focusing on the two themes of Semiconductor Applications and Net-Zero Emissions, the competition topics include:
      Semiconductor Applications:
    1. Semiconductor solutions for smart innovation and applications.
    2. Semiconductor manufacturing related processes, designs, new materials and other technologies.
    3. Net-Zero Emissions:

      Carbon reduction technologies, negative emissions technologies, energy transition, new energy and other related solutions aimed at promoting net zero emissions and sustainable development.

Contact
FUTEX Promotion Office | Annett Wu | annett@mail.tca.org.tw