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Future Tech Pavilion Wraps Up Successfully, Showcasing Award-Winning Innovations Driving Industry Transformation
2025 -10 -20
The “2025 Taiwan Innotech Expo (TIE) – Future Tech Pavilion” successfully concluded today (Oct. 18) after three days of dynamic exhibitions and events. National Science and Technology Council (NSTC) Minister Wu Cheng-Wen personally attended the closing awards ceremony to honor 83 FutureTech Award winners, 8 IC Taiwan Grand Challenge award-winning teams, and 8 AI Innovation Award winners.
Minister Wu praised Taiwan’s academic, research, and industry sectors for their continued efforts in transforming scientific achievements into practical applications. He emphasized that AI-driven innovation has become a key engine for cross-disciplinary collaboration and industrial transformation. He also noted that the Future Tech Pavilion is not only a showcase for technological achievements, but also an important platform for industry-academia exchange and collaboration, helping accelerate the real-world application and commercialization of key technologies to build a smarter future society.
Taiwanese Research Goes Global: Three Major Awards Drive Innovation Momentum
The “2025 FutureTech Award” attracted more than 500 technology submissions, with 83 breakthrough technologies ultimately selected across six major fields, including biotechnology and medical devices, advanced materials, net-zero technologies, semiconductors and optoelectronic communications, artificial intelligence, and humanities technology.
The award-winning teams demonstrated Taiwan’s strong capabilities in frontier research and innovation. Through the “Technology Presentation and Business Matchmaking Sessions,” participating teams engaged directly with domestic and international enterprises, including PEGATRON, Delta Electronics, Inventec, Fubon Financial Holding, Chunghwa Telecom, Advantech, Compal Electronics, Micron Technology, Formosa Plastics, Topco Scientific, and UHT Unitech. The event facilitated more than 40 one-on-one matchmaking meetings.
The inaugural “AI Innovation Award,” jointly organized by NSTC and Compal Electronics, focused on AI-driven application scenarios and solutions. The eight winning teams showcased how AI technologies are being implemented in healthcare, smart manufacturing, education, and other sectors. Participating companies included SYSTEX Corporation, Wistron Medical Technology, Chunghwa Telecom, WiAdvance Technology, and AUO Corporation, with approximately 20 matchmaking sessions conducted during the exhibition.
The government stated that it will continue collaborating with enterprises to accelerate the deployment of diverse AI innovations across Taiwan.
Meanwhile, the third cohort of the “IC Taiwan Grand Challenge” selected eight winning teams from 150 proposals submitted by participants from 28 countries. The awarded technologies covered AI chips, semiconductor manufacturing processes, and low-power computing solutions. Teams from major innovation hubs across Europe, the United States, and Asia demonstrated breakthroughs in high-performance computing, advanced packaging, and green energy-efficient technologies.
Through exhibition showcases and dedicated networking programs in Taiwan, these international startups connected with Taiwan’s semiconductor, industrial computer, telecommunications, and venture capital ecosystems, reinforcing Taiwan’s strategic role as a global hub for technology commercialization and international innovation collaboration.
More Than 50,000 Visitors Attend Over Three Days as Future Tech Pavilion Expands Its Global Presence
Centered on the theme “AI Cross-Disciplinary Applications × Innovative Breakthroughs,” the 2025 Future Tech Pavilion integrated research achievements from NSTC, Academia Sinica, Ministry of Education, Ministry of Health and Welfare, and Sports Administration, featuring more than 200 cutting-edge technologies.
The exhibition included six major themed zones: Smart Robotics, AI Applications and Industry-Academia Collaboration, Quantum Technology, Sports Technology, the Chip-based Industrial Innovation Program Taiwan, and the FutureTech Award exhibition area, showcasing the latest R&D achievements across diverse sectors.
One of the event’s highlights was the Smart Robotics Forum, which brought together experts from Europe, the United States, Japan, and Taiwan to discuss how AI is advancing humanoid robotics, smart manufacturing, and healthcare applications. The forum attracted a full audience throughout the sessions.
In addition to inviting industry associations, leading corporations, venture capital organizations, foreign chambers of commerce in Taiwan, and representative offices, the exhibition also actively arranged visits for university and high school students to promote science education and public engagement. More than 35 organizations attended as group delegations, and the three-day event attracted over 50,000 visitors in total.
As a leading indicator of global technology trends, the Future Tech Pavilion annually curates the most forward-looking technologies from Taiwan and around the world, offering visitors a comprehensive look at innovations emerging from academia, industry, and startups.
Following the successful conclusion of the 2025 exhibition, Future Tech Pavilion will continue promoting industrial matchmaking and international collaboration. The 2026 Future Tech Pavilion is scheduled to take place from September 17 to 19, and participants from all sectors are warmly invited to join and support the event.
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