| Technical Name |
High Precision Maskless Lithography System for Advanced IC SubstratesPackaging |
| Project Operator |
Engineering & Technology Promotion Center |
| Project Host |
李永春 |
| Summary |
This project develops a high-precision maskless lithography system consists of digital light processing, microlens / spatial filters arrays,precision servo-controlled motion technologies. Based on this maskless UV lithographic system, we are able to achieve UV patterning of arbitrarycomplicated 2D/3D microstructures for advanced IC substratepackaging.
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| Market Potential Analysis |
"l 取代實體光罩製作程序、節省製程時間與成本
l 提高無光罩式UV微影的製程精度、圖形複雜度、與微結構型貌的可變化性
l 數位式的製程模式，可以彈性生產、線上補償、與誤差即時回饋"
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| Industrial Applicability |
This maskless UV lithographic technology is particular important for large-area substrate demanding complex patterns with smaller (~10 um) feature sizes. It also has the flexibility for making three dimensional microstructure profiles on planar substrates.
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| Keyword |
Maskless Lithography UV Lithography Microstructure Micro-Fabrication Digital Light Processing Digital Micromirror Device Spatial Filters Array Microlens Array Smart Manufacturing FPGA Embedded System |
